Used ACCRETECH / TSK UF 3000 #293621716 for sale

Manufacturer
ACCRETECH / TSK
Model
UF 3000
ID: 293621716
Wafer Size: 12"
Vintage: 2006
Wafer prober, 12" Process: V5400 Hot air Load port ATT A300T Air cooled chuck X,Y Overall accuracy: ±2.0 µm (Temperature stability: ±1°C) X,Y Stage accuracy: ±1.0 µm Z Axis stroke (Applicable stroke): 37 mm Z Axis control accuracy: ±2 µm Stage durability: 200 kgf Does not include Hard Disk Drive (HDD) Power supply: 120 AC, Single phase 2006 vintage.
ACCRETECH / TSK UF 3000 is an advanced prober for semiconductor device characterization and testing. It is a modular equipment that enables a range of probing capabilities from manual, contact-based measurements to automated, contact-less measurements. This capability is utilized in a variety of settings, including wafer probing, package testing, failure analysis and more. The system features an improved touch-less design optimized for high-accuracy probing. Instead of using contact-based probes, TSK UF 3000 utilizes a 16-channel, scanning finger delay line module to collect data. This module is capable of scanning an entire wafer surface at sub-micron resolutions in an array format. This, in combination with deep-etching capability and ultra-precision manipulation, allows it to provide exceedingly high accuracy and performance. The unit also features a 4-axis driven stage that can move accurately on sub-micron scales in a variety of axes. The tool's coordinated probe machine offers both manual and automated measurement solutions. Manual probing can be done by suspending probes over the wafer surface and reading values of interest manually. Automated probing utilizes the tool's advanced optics and computer software to search for and analyze features with greater speed and accuracy than a manual approach. This can be used to detect defects and measure parameters such as resistance, capacitance and thermal characteristics. These features provide a wide range of applications for ACCRETECH UF3000. It can be used for a variety of characterization tasks such as process optimization, device performance analysis, failure analysis and life cycle testing. It is also suitable for high-volume production environments and can be integrated into existing production lines. Its contact-less approach makes it suitable for wafer probing and package testing in clean-room environments, and its high-accuracy and resolution enable it to provide detailed data on device characteristics. ACCRETECH UF 3000 is an advanced prober that offers high-accuracy, contact-less probing for a variety of semiconductor device testing applications. Its combination of advanced optics, scanning finger delay line module, 4-axis driven stage and integrated software allow it to provide high-precision data in a variety of settings. This makes it suitable for a range of process optimization, device performance analysis and failure analysis tasks, as well as high-volume production environments.
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