Used ACCRETECH / TSK UF 3000 #293621718 for sale

ACCRETECH / TSK UF 3000 is a prober that utilizes both contact and non-contact technology for effective metrology solutions. It inspects both advanced and legacy ICs and device packages for a wide range of parameters, such as electrical performance and defects. TSK UF 3000 gives users maximum accuracy and reliability through advanced optical metrology technology and has the ability to inspect samples of various thicknesses and shapes which makes it ideal for advanced wafer acceptance, process control, and failure analysis. ACCRETECH UF3000 uses a wafer alignment system that is designed to accurately find and correct the die position and tilt angle of the sample to ensure best possible test results. The prober utilizes a range of contact and non-contact technologies including optical, electrical and vacuum probing. The optical probes use non-destructive UV lasers for microscopy measurement, characterizing geometrical parameters like contours, steps, height and hole location. The electrical probes use automated prober tools for testing electrical parameters of contact pads. ACCRETECH UF 3000 features an automated wafer loader and unloader to allow for quick sample loading and extraction. The prober comes with a user-friendly GUI that is designed to make the navigation easier and faster. An array of variables and programmable test settings can be controlled through the GUI and provide increased flexibility to the entire setup. The prober also has an integrated inspection library to help store test programs and provide an easy way to access them. ACCRETECH / TSK UF3000 is capable of multitasking and testing multiple samples simultaneously, generating quick results with minimum errors. The probes are typically charged with pressurized air to ensure minimum contact force and improve reliability. The prober can also be used in a variety of environments including cleanroom, laboratory or production line. The accuracy, speed and reliability of TSK UF3000 makes it the perfect solution for wafer acceptance and die yield improvement.