Used ACCRETECH / TSK UF 3000 #293621719 for sale
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ID: 293621719
Wafer Size: 12"
Vintage: 2006
Wafer prober, 12"
Process: V5400 Hot air
Load port
ATT A300T Air cooled chuck
X,Y Overall accuracy: ±2.0 µm (Temperature stability: ±1°C)
X,Y Stage accuracy: ±1.0 µm
Z Axis stroke (Applicable stroke): 37 mm
Z Axis control accuracy: ±2 µm
Stage durability: 200 kgf
Does not include Hard Disk Drive (HDD)
Power supply: 120 AC, Single phase
2006 vintage.
ACCRETECH / TSK UF 3000 is an automated prober designed for wafer inspection and electrical characterization of semiconductor devices. This tool is highly sensitive and can detect small variations even at high temperatures. Utilizing an advanced multi-probe motion control, it enables the user to quickly and accurately map different areas of a device at variable temperatures. TSK UF 3000 supports up to 16 probes, allowing each probe to test independent devices simultaneously. The entire system is seamlessly integrated with TSK WaferScan software, enabling users to quickly measure and analyze data collected. ACCRETECH UF3000 offers a choice of different temperature ranges, which helps speed up the process. It also includes a number of different probe heads, allowing the user to make contact with the device at different angles and positions. The temperature range can be precisely controlled and can reach extreme temperatures ranging from -50°C to +400°C. This tool is also designed to inject signal energy and measure circuit response within nanoseconds for dynamic device characterization. TSK UF3000 delivers unprecedented accurate data and performance, with supporting software and high-speed signal processing. It has extensive management functions to manage the test programs, including signal to noise ratios, limiters, and adjustable dynamic range. It also has a rapidly interchangeable adapter plate, allowing quick and effortless changing of test configuration. ACCRETECH UF 3000 provides high-precision control of probe motion and Z height control for excellent accuracy. This tool is designed for both wafer level format and die level addressing. It offers powerful analysis and recording capabilities with an automatic data logging system. For reproducible high-accuracy results, UF3000 is the ideal tool. Its robust design and cutting-edge technology make it an ideal solution for rigorous inspection and electrical characterizations of dynamic semiconductor parts.
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