Used ACCRETECH / TSK UF 3000 #9094711 for sale

ACCRETECH / TSK UF 3000 is a highly precise, automated prober designed for failure analysis of ICs, which is useful in the fields of analytical metrology and material science. This equipment is capable of delivering precise positioning and accurate throughput in highly complex probing process. It combines a motion stage with a digital CCD camera on a 3 or 5 axis configuration. By incorporating these elements, the system can move the materials in many directions in order to accurately take measurements. This prober is equipped with multiple advanced diagnostics and data acquisition tools, including X-Ray, CT, SEM and Optical Comparators. The unique motion stage of TSK UF 3000 facilitates probing of a wide range of objects, even if their orientation and size isn't uniform. It has a high-resolution CCD camera unit with optical zoom engineered to maximize view angles and resolution. Additionally, its high-speed data acquisition machine gives professionals the ability to accurately capture failed ICs, and is able to detect subtle changes in the circuit functions and material surfaces. This tool has an intuitive and user-friendly touchscreen interface, featuring 3D graphical mimic editing and visualization. Furthermore, it can access data quickly and can create precise graphical plot layouts. Exact vision alignment is one of the features that guarantees a reliable and consistent results. In addition, it can handle a variety of probes, such as pogo pins, spring electrodes, laser diodes, as well as different probe card configurations. In addition, ACCRETECH UF3000 is sturdy and durable, offering superior protection against dust and contamination. Its advanced environmental control asset will enable varying temperatures and humidity. The model is also designed to minimize tool configuration changes. All the peripheral equipment is also built with advanced technology and materials to ensure a durable and reliable performance. Overall, TSK UF3000 is an excellent option for accurate and reliable testing of multilayer ICs and IC packages. With its high-end automation and advanced performance features, this equipment is the top choice for failure analysis and IC probing.