Used ACCRETECH / TSK UF 3000 #9268060 for sale

ACCRETECH / TSK UF 3000 is a sophisticated prober used in automated testing of electrical, optical, and physical characteristics of semiconductor packages and ICs. It is a high-precision, advanced prober designed to automatize prober testing and wafer-level cleanliness evaluation. TSK UF 3000 provides users with highly accurate probe card alignment and cabling, measurements, and software operation with high-repeatability. It features TSK own High Precision Optical Aligner (HPOA) technology, a two-dimensional position adjustment function that enables accurate and repeatable alignment of advanced positioning mechanisms, and a high-accuracy Force Aligner (FA) for precise contact force measurement. The equipment also includes a contact and repositioning detection system with two sensors, a pressure sensor, and a temperature sensor, which are used to ensure repeatable results. The dual-axis digital servo motor drive unit allows for accurate and reliable positioning at low speed and high speed. ACCRETECH UF3000 also includes advanced features such as a high-resolution microscope optical machine, an automated microscope calibration function, and a contact force control tool. This prober can be used with a variety of holders designed specifically for measuring multiple packages, including QFN, BGA, VFBGA, and bare die. UF3000 is equipped with an enhanced level of automation, providing cost savings and improved productivity. It is capable of automatically aligning and selecting the proper holder for the task, rapidly calibrating holders, automatically generating reports and charts, automatically loading prober motion settings, and rapidly assessing multiple parametric parameters. TSK UF3000 is a highly reliable and accurate prober that is perfect for precise and repeatable prober testing. It features an integrated PC and user- friendly software for convenient operation and easy maintenance. UF 3000 is a valuable tool for quality assurance purposes for manufacturers of semiconductor packages and ICs.