Used ACCRETECH / TSK UF 3000 #9293772 for sale

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ACCRETECH / TSK UF 3000
Sold
Manufacturer
ACCRETECH / TSK
Model
UF 3000
ID: 9293772
Wafer Size: 12"
Vintage: 2006
Wafer prober, 12" Chuck type: Nickel Hard Disk Drive (HDD) Floppy Disk Drive (FDD), 3.5" Magneto-Optical drive (MO Drive) Head stage Single loader Loader type: FOUP and Open cassette Dual robotic wafer transport arms Pre-alignment stage unit Auto needle alignment Alignment camera Dual (X and Y) HEIDENHAIN scales Color LCD control panel with touch panel switches Alarm lamp pole Options: Hot chuck: +30°C to +150°C Needle cleaning: Wafer type, polish plate Multi-site parallel probing Fail mark inspection Probe mark inspection GPIB Interface Ethernet interface Automatic Card Changer (ACC) Image processing board Bump height settings Group index Multi-pass probe Printer Network option: Veganet CE Marked 2006 vintage.
ACCRETECH / TSK UF 3000 is an advanced, automated prober designed for use in modern semiconductor manufacturing processes. It is capable of performing a variety of probing operations rapidly and accurately, such as testing, probing, and die sorting. TSK UF 3000 features a modular PPD - prober platform design that allows for implementation of new technologies quickly and efficiently. This model supports multiple wafers or chips on a single quadrant alignment head prober in order to minimize throughput time and achieve fast probing cycles. The PPD is equipped with numerous peripherals and options, including wafer loss detection equipment, unique vacuum chuck, different types of robot arms, motor drivers, quick-change probe cards, special force calibrations, as well as vision systems. ACCRETECH UF3000 also allows access to data operation, performance analyses, and other processed information. UF 3000 prober is designed to optimize production efficiency and minimize cost, while providing maximum throughput and yield. It is capable of sampling a variety of wafer sizes and its minimal footprint allows for lower cost alignment space. The prober's universal 4-quadrant alignment design facilitates probing operations for two, three, or four types of test heads. The combination of a motorized Z-axis (axis of motion perpendicular to wafer surface); fine pitch machine screws in X and Y; and high power control module enable high-precision probing. ACCRETECH UF 3000 has a unique interlock system that provides full visibility of the test head for verification, maintenance, and calibration before and after each operation. UF3000 has a robust contact and non-contact force control unit with software-controlled contact forces and adjustable force per contact. This ensures secure connection and accurate performance of probes during operation. The machine also features a set of configurable probes that allows users to configure the optimal sensing parameters for each application. ACCRETECH / TSK UF3000 prober also includes an advanced high speed v-groove alignment machine to ensure accurate alignment of the test chips. The v-groove design offers a variety of probe positions to ensure perfect alignment of each test chip. Additionally, TSK UF3000 is capable of functioning in manual, automatic, or semi-automatic operation, allowing users to select the most suitable operation for their application. Overall, ACCRETECH / TSK UF 3000 is a highly efficient and accurate prober, capable of quickly and accurately performing a variety of probing operations. It is designed to minimize cost, while maximizing throughput and yield. Its advanced features and configurable probes allow users to optimize the performance of the prober according to their specific requirements.
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