Used ACCRETECH / TSK UF 3000 #9308941 for sale
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ID: 9308941
Wafer Size: 12"
Vintage: 2006
Wafer prober, 12"
Single loadport
KEYENCE BL-601HAC1 Cassette ID Reader
Chuck size, 12"
Chuck material: NICKEL Coating
ARTS-LC12 Low temp chuck
Chuck temperature range: -40~150℃
Temperature unified chuck
External chiller unit: SHI SCU500S
Auto probe to pad alignment
Needle mark inspection
Fail mark inspection
Surface wafer ID OCR: Insight 1700 series
Auto needle height and align: Auto / Manual card change
Soak time option
Probe card changer
3-64 Multi-site probing: 1~1024
ACCRETECH GPIB Interface: Standard command
RS232 Interface
MHF6000 Hinge manipulator
Test system interface: Micron C1D (Tester is not included)
Cold temperature
Side loader
X,Y Overall accuracy: ±2.0 µm (Temperature stability: ±1°C)
X,Y Stage accuracy: ±1.0 µm
Z-Axis stoke: 37 mm
Z-Axis control accuracy: ±2 µm
Stage durability: 200 kgf
Hot and cold chuck
SCU-600 Chiller
Temperature range: -40ºC to 150°C
No Hard Disk Drive (HDD)
2006 vintage.
ACCRETECH / TSK UF 3000 is a prober equipment designed to provide automated wafer probing and test capabilities. The system is capable of supporting up to 8 wafer probe cards simultaneously and handles wafer diameters up to 300mm with adjustable X/Y stage TABLE extensions. It is compatible with Semiconductor Process Control (SPC) to facilitate process optimization, and the integrated User Interface (UI) is designed to provide the user with the ability to easily program and monitor the automated prober unit. TSK UF 3000 features a modular design and provides an extensive list of features, such as, a unique dual stage motion machine which results in faster wafer transfer times and the ability to quickly restage the wafer under dynamic load conditions. This allows for higher throughput, improved wafer capacity and far reduces engineering times. An integrated environmental chamber also enables the tool to be used for temperature/humidity control tests and stable temperature measurements, making it ideal for testing a wide range of devices. The asset is also equipped with high-precision laser autofocus which makes it capable of managing a variety of different wafer types, from small to large samples. This allows the model to minimize mechanical probe misalignment and maximize accuracy. Additionally, the equipment incorporates a vacuum wafer clamping system for increased stability and improved repeatability. This is further optimized by an ergonomic design that provides a low uncomfortable motion range, which results in reduced fatigue and improved accuracy over continuous probing. ACCRETECH UF3000 also supports Ethernet Remote Control (ERC) functionality and SPC/EPS Waveform measurement functionality, allowing users to access and monitor the prober status and data remotely. Finally, it is compatible with a variety of operating systems, such as, Microsoft Windows, MacOS, Linux, and Android, allowing users to easily run the software required to control and monitor the unit.
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