Used ACCRETECH / TSK UF 3000 #9350284 for sale

ACCRETECH / TSK UF 3000 is a prober equipment designed for process analysis and product development. It is an advanced, advanced metrology system that combines scanning electron microscopy (SEM), energy dispersive spectrometry (EDS), and advanced optics to provide images and data with high accuracy and precision. TSK UF 3000 is capable of providing detailed, non-destructive analysis of complex materials. ACCRETECH UF3000 features a modular design, allowing for easy access and installation. Its automated features offer fast process monitoring and process control capabilities. It's also designed for operation in various conditions, such as extreme temperatures, and high humidity or vacuum. The unit includes a high-resolution CCD camera for capturing images of samples for analysis. It also includes an imaging machine for measuring surface movement and examining surface features. UF 3000 is equipped with a multi-channel four-out solution, which includes five narrow beams that produce high-resolution images, and spectral analysis capabilities. The four-out solution, designed for CVD, RTP and other processes, also includes options for low-energy, medium-energy, high-energy and pulsed X-ray emission spectroscopy. In addition, the tool provides an automatic, continuous drift corrections, to minimize sample distortion. UF3000's advanced imaging capabilities are also used for process control and development. Its edge detection and extraction functions allow for accurate characterization and measurement of features and nanostructures, and with its particle analysis capabilities, it can be used to analyze the size and presence of particles. It also offers advanced functional imaging, combining EDX, and EBSD data to provide quality assurance parameters. ACCRETECH / TSK UF3000 is an advanced metrology asset designed for process analysis. Its flexible design and modular construction allows for quick and easy setup and installation, while its multiplex solutions provide a wide range of data complexities for processing and analysis. It is designed to provide accurate, non-destructive, non-contact measurements of materials. Its advanced imaging and spectral analysis capabilities allow for detailed characterization and process control.