Used ACCRETECH / TSK UF 3000 #9352941 for sale

ACCRETECH / TSK UF 3000 is a prober designed for advanced automatic wafer analysis and inspection applications. It features a high-performance, high-precision architecture combined with a large sample size and high scanning speed. The prober offers high sampling precision, with sampling rates faster than those of rival systems. TSK UF 3000 provides superior sampling accuracy over an optimized sample range of 200 - 5000um. The prober is designed as a two-stage scanning equipment, allowing efficient sample processing and high-precision results. The first stage is the main scanning mechanism, which consists of two XY linear scanning mechanisms with an accuracy of 0.1 micron. The second stage is a thermally-stable platform, which maintains sample temperature during probeconfiguration. ACCRETECH UF3000 offers integrated system capabilities including metrology, die-to-die mapping, and defect detection. Its die-to-die mapping capabilities enable advanced defect evaluation and allow users to create a detailed map of defect hotspots. Its metrology capabilities include real-time wafer thickness measurement, alignment and sigma-z measurements. TSK UF3000 is a complex unit and requires careful setup and operation. It is fully compatible with TSK ProberControl III software. ProberControl III provides intuitive control over the machine for efficient operation. It facilitates easy setup and analysis of device parameters, control of probe tip positioning, as well as simulation, segmenting, and batch configuration. UF3000 provides reliable results with high precision and is capable of managing rapid defect inspection on a wide range of bonded and un-bonded quality assurance tests. The tool is ideal for advanced wafer analysis applications and offers a broad range of versatile features that enable efficient and accurate inspection of wafer characteristics.