Used ACCRETECH / TSK UF 3000 #9353251 for sale

ACCRETECH / TSK UF 3000 is a prober designed for automated probing applications in semiconductor and other package engineering processes, such as high speed wafer testing. It is a complete solution for high-precision probing, with a large, precision, inspection and probing head, a specialized probe interface unit, and comprehensive software for controlling the prober. TSK UF 3000 probe head has a large stage of 500 x 500 mm, and an independent sample fixture and probe holder with a movable platform. It is equipped with high-precision linear motor stages and a vibration isolation system to provide an exceptionally stable environment for probing. The probe head also features an auto pre-align feature for sample placement accuracy and a sample pre-heat function for uniform sample temperature. The prober is powered by a dedicated probe interface unit, which provides a wide range of voltages and currents for handling sensitive analog signals and high-current measurements. This also includes advanced error detection, alarm and programming features to ensure accurate and reliable control of the prober. The firmware of the interface is upgradeable, for compatibility with the latest version of the system software. The prober's software, ACCRETECH UF3000 Probing System Software, offers a comprehensive suite of tools for controlling and managing UF3000's probes, fixtures, probes, and software. It allows for precise control over calibration and set-up, sample movements, via-hole detection, probe alignment, surface test, and other tasks related to probing. The software also facilitates data analysis, reporting, and traceability. In addition to its comprehensive capabilities for automated prober testing, TSK UF3000 is compliant with industry standards and meets the latest safety regulations. It also comes with enhanced service and support, which can be accessed through TSK customer support portal. UF 3000 prober is a robust, reliable, and accurate solution for semiconductor and other package engineering processes. With its large and precise probe head, specialized probe interface, and comprehensive software, it is an ideal solution for automated prober testing and production-level probing applications.