Used ACCRETECH / TSK UF 3000 #9354562 for sale

ACCRETECH / TSK UF 3000 is an advanced prober designed for the testing of semiconductor devices and material characterization. It has a simple and modular architecture, which allows for easy scaling of capabilities. TSK UF 3000 has a high vacuum chamber capable of 15nTorr, equipping it with the capability to form via-holes, inspect multi-layer substrates, and characterize contacts. This tool has an advanced vision system, which includes both 2D and 3D imaging for higher resolution. Using the dual high-precision XY stages, the prober can easily move across the device and accurately capture images for inspection purposes. Additionally, ACCRETECH UF3000 has six high-precision theta stages for more precise probing of the device. ACCRETECH UF 3000 also includes a wide range of features that enable efficient chip probing. It has an advanced substrate control system, which includes a unique design that can scan and detect physical defects on the wafer's surface. This system can also be used for pad and probe contact measurement, offering the user accurate and repeatable results. In order to help ensure the accuracy and consistency of test results, UF3000 has an embedded controller for setting the scan oscillation parameters, along with pre-set test operation procedures. In addition, UF 3000 has an ergonomic design for easy access to the prober's backside. This ensures that all components, such as pumps, tanks, and chillers, are easily accessible for servicing and maintenance. The design also allows for faster device loading and unloading, shortening the probing cycle time for increased productivity. TSK UF3000 also provides enhanced safety and security features, including two solenoid shutters for protecting the wafer and preventing contamination. It is also equipped with noise monitoring sensors that will detect and alert the user to any abnormally high noise levels that could cause harm or damage to the equipment. Overall, ACCRETECH / TSK UF3000 prober is an advanced testing and characterization tool that includes all the necessary features for testing semiconductor devices. It offers a high vacuum chamber, dual XY stages, high-precision theta stages, advanced vision systems, and embedded controllers for efficient chip probing. In addition, its ergonomic design provides easy access to the prober's backside for faster device loading and unloading. Finally, its safety and security features ensure that the wafer and the equipment are protected from any harm or damage.