Used ACCRETECH / TSK UF 3000 #9375638 for sale
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ID: 9375638
Vintage: 2007
Prober
Single loader
Head stage
Hot chuck, 8"-12"
Chuck material: Nickel
Hard Disk Drive (HDD)
Floppt Disk Drive (FDD), 3.5"
Magneto optical drive
Loader type: FOUP, Open cassette
Dual robotic wafer transport arms
Pre-alignment stage unit
Auto needle alignment
Alignment camera
X, Y Dual HEIDENHAIN scales
Color LCD control panel
With touch panel switches
Alarm lamp pole
Options:
Hot chuck: 30°C to 150°C
Wafer ID recognition
Needle cleaning option:
Wafer type
polish plate
Multi site parallel probing
Fail mark inspection
Probe mark inspection
GPIB Interface
Ethernet interface
Automatic probe card changer
Image processing board
Bump height setting
Group index
Multi pass probing
Printer
Network: Veganet
Tester and manipulator: ST MT72
CE Marked
2007 vintage.
ACCRETECH / TSK UF 3000 is a prober designed for advanced failure analysis in modern semiconductor devices. The prober allows users to quickly and easily identify and isolate potential defects or yield issues and makes advanced failure analysis much faster and more efficient. TSK UF 3000 prober has a large 8-inch wafer capacity. It features an adjustable, high-resolution video camera for obtaining detailed images of the probe site and can also conduct a variety of impedance and power tests. The prober is optimized for high precision and is accurate to within 0.1 micrometers. The probe tip is equipped with a three-axis digital servo controller for precise motion control. The prober is equipped with a built-in measurement system, which provides real-time performance measurements and automatic logging of probe results. It is able to handle a variety of test conditions and measuring parameters, including voltage, current, and temperature. The prober is fully programmable and can be used in a wide range of applications, from wafer testing and evaluation to defect identification. ACCRETECH UF3000 prober is also able to monitor an extensive range of parametric information. It has the capability to measure high-frequency response, frequency response, and differential capacitance. The prober is also capable of performing power measurements, such as power-rail voltage drop and power-on/power-off stability. It can also measure low-level noise performance by capturing s-parameters and pulse-induced shift rates (PISR). The prober incorporates high-density imaging which can detect defects as small as 0.4 microns. It can be used with a variety of integrated circuit characteristics, such as 3D die stacking and use of embedded and discrete thin-film structures. Additionally, the prober can be used for post-etch inspections and is designed to be fully compatible with existing measurement control systems. UF 3000 prober offers a great combination of accuracy, speed, and power designed to make advanced failure analysis fast and efficient. It is designed to be user-friendly and has an intuitive interface which allows users to quickly get up and running. It provides a comprehensive set of features and performance capabilities for probing and testing a variety of modern semiconductor devices.
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