Used ACCRETECH / TSK UF 3000EX-e #9232996 for sale

ACCRETECH / TSK UF 3000EX-e
Manufacturer
ACCRETECH / TSK
Model
UF 3000EX-e
ID: 9232996
Probers Direct docking.
ACCRETECH / TSK UF 3000EX-e is a high-performance prober designed for testing both wafers and substrate materials. The prober features a dual-side motor control system, allowing for precise positioning of the wafer and substrate with a high degree of accuracy. Its modular design provides flexibility, allowing the prober to be tailored to specific testing requirements. The prober's wafer stage features a linear gauge with a resolution of 0.0633 nm per step, enabling precise positioning and alignment of the wafer. It also includes a vacuum chuck for securing the wafer in place during testing and a pneumatic chucking system for contact measurement of wafer surface. The prober's substrate stage includes an automated linear stage with a 0.5 micron resolution, as well as a granite base for maximum stability during measurements. Furthermore, the prober is equipped with a measurement head, which consists of a pair of parallel and perpendicular measuring axes, providing high precision and repeatability for measuring the properties of the substrate material. The prober features easy-to-use software, designed to control the various programs and functions of the prober with user-friendly commands. This software enables the prober to accurately measure the physical dimensions and properties of various substrates and packages. Additionally, the prober provides a full range of electrical testing, including probing impedance, cap fault analysis, status open/closed analysis, and frequency sweep. Overall, TSK UF3000EX-E is a high performance prober designed to provide reliable and accurate testing for a variety of wafer and substrate materials. Its modular design and powerful software allow users to customize the prober for their specific needs while providing excellent stability, precision, and repeatability for precise measurements. The prober is ideal for applications including wafer/substrate analysis, wafer burn-in testing, and semiconductor testing.
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