Used ACCRETECH / TSK UF 3000EX-e #9279317 for sale
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ID: 9279317
Wafer Size: 8"-12"
Vintage: 2017
Wafer prober, 8"-12"
OCR
Card changer
Chuck type: Nickel
Hot chuck
Chuck controller temperature range and accuracy: Ambient to hot
XY Position accuracy
Pin to pad alignment
Fail mark inspection
Needle alignment
Auto needle height setting
Color LCD display
No off site marker
Bump height setting
Needle inspection
Wafer mapping capability
GP-IB
RS232
No TTL
Color display
Touch screen
2017 vintage.
ACCRETECH / TSK UF 3000EX-e is a fully automated prober specifically designed for high-capacity wafer testing. It is capable of testing and probing multiple wafer types ranging from 150mm to 300mm in size. The unit utilizes a high-precision moving stage that can travel up to 2mm/s for accurate probing and testing with minimal die shifting. The prober boasts 16-bit resolution with repeat precision of 0.5um for pinpoint accuracy. Its host-driven design gives users the flexibility to choose either an open-loop or closed-loop probing equipment, allowing for additional capabilities such as scatterometry, beam profiling, overlay profiling, and voltage contrast mapping. The unit is also designed to accommodate a wide range of probe cards and features an integrated probe card loader. The prober also includes a vision alignment system that compensates for X, Y, Z offsets, enabling optimal die placement with improved accuracy. In order to maximize performance and efficiency, TSK UF3000EX-E is equipped with a direct-drive motor unit that eliminates mechanical losses associated with rotating components. Additionally, the drive machine can accurately accelerate up to 10m/s2, allowing the wafer mapper to quickly reach its desired testing area, reducing cycle time. The prober also offers a range of capabilities suited for ATE applications such as thermal cycling, laser marking, blade pick-up, and electrical failure analysis. ACCRETECH UF 3000 EXE is also EPA-certified for optimal safety and climate control, ensuring that the unit operates within the required temperature range. Overall, UF 3000EX-e is an advanced and reliable prober that enables maximum testing throughput for wafers ranging from 150mm to 300mm in size. It features a high-precision moving stage, an integrated vision alignment tool, a host-driven design, and a variety of additional capabilities, making it the ideal choice for high-capacity wafer testing.
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