Used ACCRETECH / TSK UF 3000EX-f #293597821 for sale

Manufacturer
ACCRETECH / TSK
Model
UF 3000EX-f
ID: 293597821
Wafer Size: 12"
Vintage: 2013
Prober, 12" Real time wafer map display Multi-site probing function: 3-64 dies Needle cleaning RTGR-48 Probe card holder Chuck type: Nickel, 12" Offline ink function Ink check function Needle inspection Profiler sensor Accuracy: ±2 µm Wafer diameter, 5"-12" Thickness: 200-1000 um Thickness variation: Less than ±50 um Vacuum supply: Less than 50kPa, 30 liters/minute X, Y-Axis: Probing area: ±170 mm Maximum speed: 500 mm/s Resolution: 0.5um Z-Axis: Full stroke: 37 mm Maximum speed: 30 mm/sec Resolution: 3.75 um Chuck Z control Control accuracy: ±2 um Over travel: 0~500um 0-Axis rotation range: ±4° Resolution: 0.00028° Fine alignment: CCD ITV Image processing Hard Disk Drive (HDD) Capacity: 40G bytes Drive Floppy Disk Drive (FDD) Disk nominal size: 3.5" USB Interface: External memory Display: TFT High color LCD, 15" Power supply: AC 220 ± 20 V, 3 kVA 2013 vintage.
ACCRETECH / TSK UF 3000EX-f Prober is a high-performance production testing device designed to quickly and accurately test silicon wafer device characteristics. It is a fully automated, comprehensive equipment that includes all the advanced features required to test wafers at high speeds. TSK UF 3000EX-f Prober runs on advanced mechanized probing technology and is equipped with state-of-the-art technologies, including a 360° heated platform, horizontal and vertical probing, a level sensor, and a wide range of automated processes including datasheet parametric testing, optical inspection, and a temperature-controlled environment. ACCRETECH UF 3000 EX-F Prober has advanced features like a high-precision wafer chuck, which can hold wafers up to 16 inch in diameter, and accommodates various thicknesses. The flexible lift system is capable of quickly translating the chuck in the z-axis to precisely measure the wafer's thickness. The horizontal and vertical probes are designed for optimal dynamic range, avoiding collisions between probes and allowing for a wide range of probing points. The probing unit also has various ESD testing options including leak detector and failure analyses. The Probe Card Module of TSK UF 3000 EX-F Prober has multiple configuration options, including 256 channels, 640 channels, and 1024 channels. This allows for ultra-high probing accuracy and a much faster probing rate. Additionally, the automated feature makes it easy to store and recall job settings. The temperature controlled environment is coupled with a powerful thermal imaging camera which ensures excellent repeatability and accuracy. ACCRETECH / TSK UF 3000 EX-F Prober also comes with an optical review unit for defect detection. This machine uses advanced imaging to detect microedge defects, wear particles and other anomalies. It is highly accurate and can detect defects on even the smallest lot sizes. The software enables engineers to analyze and review images in real time and make decisions quickly. The tool is easy to use, with a powerful graphical user interface and an intuitive drag-and-drop design. UF 3000EX-f Prober is a powerful tool that can quickly and accurately test wafers and other microelectronic devices. It offers high repeatability, accuracy and speed, making it a reliable and robust testing solution for production environments. The automated features make it easy to store and recall job settings, and the intuitive interface makes it easy to review results. With its advanced features and technological capabilities, UF 3000 EX-F Prober is the ideal prober for quality testing.
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