Used ACCRETECH / TSK UF 3000EX #9160372 for sale

ACCRETECH / TSK UF 3000EX prober is a next-generation electro-optical prober designed to boost yields in wafer testing and electrical-optical inspection. It is capable of probing wafers up to 8 inches in diameter with up to 25 pins. It features a selectable level of sensitivity, allowing for the widest range of probing applications. Its advanced XY motion system ensures precise and consistent data collection for both probing and mating probes. TSK UF3000EX utilizes a stylus probe with 25 independent pins, allowing for multi-site measurement and localization with a single insertion on the wafer. The probe is engineered to deliver maximum performance on all types of wafers. It has two linear deformation sensors for the virtual transfer of alignment and force settings, enabling fast and efficient probe set up. The prober's optics can be equipped with one or two cameras, depending on the application. This will provide the user detailed inspection images to examine quickly and accurately. The cameras also can be outfitted with filters to permit different wavelengths. This will allow for a safe observation of the wafer's photolithographic pattern, enabling more accurate measurement results and verification of failure pattern causes. ACCRETECH UF 3000 EX offers a host of other features to ensure reliable, accurate performance. It has a built-in interlock that prevents damage to the probe tip and a safety circuit that monitors the heat level generated by the movement of the probe. TSK UF 3000EX is also equipped with a vision system for alignment and focusing. This system has a particle recognition function to quickly and accurately locate chips on the wafer as well as an imaging algorithm that allows for statistical analysis of images. To ensure precise and consistent performance, ACCRETECH UF3000EX uses closed-loop encoder feedback. UF3000EX prober is designed to maximize the performance of wafer test and optical inspection processes. It is ideal for semiconductor applications, as it combines high accuracy measurements, verification of failure patterns, and exceptional performance.