Used ACCRETECH / TSK UF 3000EX #9411131 for sale

ACCRETECH / TSK UF 3000EX is a precision prober specifically designed for microelectronics. This state-of-the-art equipment provides the highest performance in Interface and Microelectronic wafer probing with innovative features such as high-speed laser autofocus and automatic Chuck exchange. TSK UF3000EX utilizes a newly developed inverted microscope to take sharp images, which have a higher objective resolution of 0.5μm. This advanced system has an image analyzer that can detect critical defects with a 5μm effective capturing size and store up to 20,000 different images. With a 13 axial-vision stage, this model allows for orbital movement for optimal physical contact between the probe and the device. The prober's GVG-nominal Z-axis resolution is 1.7-micron, making the unit capable of performing parallel probe operations with a range of test parameters. This allows for a high degree of freedom when selecting probe geometries for a specific device. To increase throughput speed, ACCRETECH UF 3000 EX is equipped with two high-speed spindles and two robots to move devices around the stage. To reduce contamination in the testing processes, the machine has an internal three-channel atmosphere prober to purify the environment before and after probing. The tool also has a return-to-probe capability to reduce downtime and lost production. This versatile and reliable prober is compatible with a wide array of test systems, probes, and sorting systems. For example, it is capable of operating with a variety of test and control substrates such as CIS (Chip-on-Substrate), RDF (RFID), and SMD (Surface Mount Device). Its user friendly operation makes it easy to use and intuitive to learn. ACCRETECH UF 3000EX can be easily adapted to any environment or application. From semiconductor wafers to devices with special substrate thicknesses, ACCRETECH / TSK UF 3000 EX can be configured to perform the job quickly and accurately in any environment.