Used ACCRETECH / TSK UF 300A #9211364 for sale

ACCRETECH / TSK UF 300A is a wafer prober for semiconductor device performance testing. This prober is designed to meet the stringent requirements of production testing, as well as the most demanding processes developed during product development. The prober features a large load capacity and improved operation speed, providing faster test times and greater efficiency. The prober is built around three main components. The first is the prober head, which is a motorized instrument that positions the wafer for electrical testing with precise accuracy. The moving prober head travels in the X, Y, and Z axes and can hold the wafer in multiple angles and positions. The second component is the probe card container. The container holds the probe card at the chip site, attaching the wafer to the electrical tester. The container is designed to ensure secure and tight seating, providing good electrical performance. The third component is the electrical tester. It is connected to the prober head via the probe card and is responsible for testing the device's performance. TSK UF300A features a high-resolution, auto-leveling, XYZ mechanical stage for precision wafer placement. This allows for accurate chip to chip XY positioning, repeatable XY positions over time, and excellent linearity over the entire range. The arm also has two built-in digital encoders for heightened accuracy and repeatable set points. ACCRETECH UF-300A is designed to accommodate a wide range of test parameters, including single or multiple contacts, open and closed-loop testing, low-resistance form-measurement, and high-voltage testing applications. This prober also features an integrated 2-axis stage, allowing it to be used for wafer-level device testing. The prober has two independent arm positions and a large table capacity, enabling it to easily track multiple wafer sizes. The prober is also equipped with an Auto Probe System, which eliminates errors in contact position and performance, allowing for more accurate and repeatable results. This system also features a low-contact-force mechanism that reduces damage to delicate technologies such as solder-bump probing. The prober is capable of testing multiple wafers simultaneously, further accelerating test time and improving overall productivity. The prober is also equipped with a detachable head, allowing for easy configuration, transport, and maintenance. ACCRETECH / TSK UF 300 A is a robust and flexible prober, capable of meeting the most demanding requirements of Semiconductor device test and development. The three-part design provides excellent performance across multiple applications, while the integrated auto probe system allows for smoother and more reliable operation. The high-load capacity and two-axis stage enable fast and accurate testing over a wide range of wafer sizes. UF 300 A is an invaluable tool for rapid device testing, helping manufacturers stay ahead of their competitors and offering quality products.