Used APPLIED PRECISION / RUDOLPH PRVX3 #9246514 for sale

APPLIED PRECISION / RUDOLPH PRVX3 is a professional wafer prober designed for a variety of applications in the semiconductor industry. The prober is designed for rapid, accurate, and repeatable probing of silicon wafers and other sample types. It features automated detection and response to wafer defects, enabling an efficient probing process. RUDOLPH PRVX3 utilizes RUDOLPH advanced GoldScan 3 imaging equipment, which includes SMIF and WASS (Wafer Automated Scanning System) technologies. The GoldScan 3 is an optical inspection unit that uses laser-based position sensing and measurement to identify defects, such as dust and particles, while quickly and accurately identifying probe site locations. Its algorithms are optimized for high-resolution imaging at varying levels of magnification, enabling it to be used for both incoming wafer inspection and wafer edge defect analysis. The machine also incorporates Universal Machine Language (UML) software, a feature that simplifies programming and automates the design and control of the probing sequence. The UML software also enables data transfer between APPLIED PRECISION PRVX3 and various external systems, integrating it with the manufacturing process. The tool also has an advanced integrated vacuum air station that provides the vacuum necessary for probing and is designed to be reliable and long-lasting. It also offers a wide selection of vision systems depending upon the customer's specific requirements, along with adjustable probes catering to different surface topologies and high-temperature tests. Lastly, PRVX3 comes with a hot chuck and transfer blade and a wide range of wafer handlers to ensure accurate and repeatable probing. To summarize, APPLIED PRECISION / RUDOLPH PRVX3 is a high-precision prober that delivers automated detection and response to wafer defects, enabling repeatable probing. Its GoldScan 3 proprietary imaging tool provides high-resolution imaging, UML software simplifies the programming process, and an integrated vacuum air station ensures reliable, long-lasting performance. Lastly, the asset offers adjustable probes, wafer handlers, a hot chuck, and a transfer blade for accurate and repeatable wafer probing.