Used ELECTROGLAS 3001X #9201995 for sale

ELECTROGLAS 3001X is a prober designed to automate the process of electrical test on semiconductor die and devices. It is used for wafer probing in conjunction with machine vision systems for characterization and test. 3001X is a fully automated platform that is built on a modular and expandable architecture. It offers precision motion control and accuracy for fine pitch probing and has a low thermal profile for high speed scanning. ELECTROGLAS 3001X prober is designed to provide the highest levels of performance and superior range of capability, coupled with innovative and flexible design features. 3001X armed with standard features such as two-dimensional motion, dual sample exchange, and automated vision driven feeder loading. It provides high automation for wafer testing, semiconductor die test, and full data management. ELECTROGLAS 3001X works with automated wafer testing systems such as IBMs iProbe Cobasys and California Instruments TPA2. Additionally, the prober can work with any customer specified machine vision systems. 3001X is designed to decrease the cost of test and to increase test efficiency. Its modular architecture facilitates the evolution of wafer probing standards. The prober offers significant cost saving advantages and minimizes handling time throughout the probing process by increasing production throughput. It can provide bidirectional, panoramic and gap-less scanning for automated test of each contact site. The prober provides sample capacity of up to 33 wafers and has a footprint that is optimized for electrical test system exploitation. ELECTROGLAS 3001X is also designed with GEM, an operating system with a graphical user interface (GUI). This GUI can be used to execute simple command lines, misalignment correction, and feedback for process control. Using the GUI, users can define test program formats with intuitive and simple ease. The prober is also designed for high accuracy, repeatability and resolution of up to two nanometers. In addition, 3001X can accommodate multiple electrical probe design with precision. It has a vibration-isolated SMA mover design which provides mechanical rigidity and resolution performance, as well as a robust skew-free mover design for improved vertical drive and Z-axis shock protection. Finally, ELECTROGLAS 3001X comes with comprehensive support which includes an upgrade path, remote service, online services, and service network. It also offers comprehensive support for applications in die handling, wafer sorting, device characterization, and automated test. 3001X is ideal for semiconductor device and process development and production, as it provides advanced probing technology with unparalleled performance and flexibility.