Used ELECTROGLAS 4085 #9400275 for sale

Manufacturer
ELECTROGLAS
Model
4085
ID: 9400275
Prober Chuck material: Ni Chuck type: Ambient Z-Resolution: 0.25 mil No flat panel display Options: OCR Tester interface: GPIB Ethernet interface No PTPA No PTPO No PMI No IDI No STAA No WSSC No APCC.
ELECTROGLAS 4085 is an automated wafer prober designed and manufactured by ELECTROGLAS. It is typically used in the semiconductor industry for singulation, as well as for testing and measuring integrated circuits and bare die before, during and after packaging stages. 4085 features a circular probe card with a 360° rotary head and a thermal chuck capable of operating from -20°C to +200°C. It also has a versatile indexing mechanism that allows for easy tool changes for multilayer substrates. The highly accurate and repeatable drive motor is capable of indexing with a minimum of 10 microns accuracy. The prober is able to measure standard wafer sizes from 200mm to 300mm, enabling a wide variety of devices to be tested. ELECTROGLAS 4085 is designed with a 'clean room' compliant environment ensuring protection of high value products and structures, making it ideal for highly sensitive processes. The product is also equipped with an advanced vision system that enables automatic alignment of the device to be tested using a comparison of the shape of the device with a reference image. For enhanced usability and throughput, 4085 prober supports a comprehensive set of printing and scanning functions. To physically contact the device to be tested, ELECTROGLAS 4085 utilizes a spring-loaded electrical probe, allowing testing of a variety of contact pads. A range of different needles sizes can also be used from ribbons to pins, ULT probes and GP probes. Finally, a superior scanning speed of up to 10,000 points per second provides for reliable and precise testing. 4085 automated prober is an ideal solution for volume testing production in all stages of the semiconductor manufacturing, allowing testing of various types of integrated circuits, including C4, BGA and Flip Chip, with higher levels of accuracy and repeatability. Its diverse capabilities, combined with its flexible modular design, make it an ideal choice for high volume users looking for reliable and repeatable testing processes.
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