Used ELECTROGLAS 6320 #184881 for sale

ELECTROGLAS 6320 is a high-performance prober designed to serve a wide variety of wafer probing applications. The prober is highly accurate and reliable with a flexible, user-friendly operation and control. 6320 accommodates wafers from 150 mm to 200 mm with an automatic edge-detection equipment. The large wafer area is ideal for testing large device design with minimum penalty for "over-size" devices. The prober is designed with a plain-surface die positioning vacuum chuck. This allows for high-efficiency die placement and contact-tip placement accuracy, with contact-tip placement accuracy better than 5 microns. In addition, the prober includes an XYZ positional correction mechanism which is employed while the prober is in operation. This correction mechanism allows the prober to adjust itself according to different conditions, such as substrate size and a misalignment of the substrate. This mechanism optimizes probing accuracy. The prober is also equipped with an automated chuck pressure control system. This unit is used to assist in ensuring uniform and consistent contact between the wafer probe and the wafer. The prober has an integrated wafer backside inspection machine with light sources, visual and laser sensors, and auto-focus. Furthermore, the prober is fitted with a built-in failure detection unit. This unit detects short circuits and open circuits in the probe-to-pad contact process. The failure detection unit ensures dependability and repeatability, enabling reliable production and repair processes in the repair company. The prober is designed to be user-friendly with a capacitive touch monitor, wafer library and a skin-sensing user interface. The prober comes with a probe card library with a total of 800 cards, including standard circuit cards and non-standard special function cards. In conclusion, ELECTROGLAS 6320 is a robust, high-speed, high precision prober designed to serve a wide variety of wafer probing applications. It is equipped with an automated chuck pressure control tool, XYZ positional correction mechanism, a failure detection unit, a capacitive touch monitor and more for reliable and accurate operation. With its wide range of features, it can provide a dependable and consistent wafer testing and probing process.