Used ELECTROGLAS / EG 2001X #9282036 for sale
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ELECTROGLAS / EG 2001X is a high-precision automated prober developed for a broad range of applications. It is designed to perform small wafer probing processes with extreme accuracy. The machine features a fully automated wafer alignment system for probing and performing measurements in a variety of different wafer sizes and formats. Its motorized X-Y stage positions the wafer precisely at the target coordinates using position encoders and a set of probes for specific applications. The advanced optical displays, optical zoom probe head, manual probe arm and video microscope all allow for probing with extreme precision. It can detect faults, defects and shorts, perform measurement and characterization of ICs, and diagnose wafer and package failures. A powerful CNC/Ethernet interface easily allows operators to control probing operations. EG 2001 X has a wide range of probing capabilities with various options and configurations. It supports single-point, 3-D and multi-die packages and assemblies, flat and flared end probes, cantilevered probe needles, and manual control multiplexers. It is equipped with a variety of probe heads for different probing needs, such as low stiction needles and fine-tipped tips. The user-friendly software on ELECTROGLAS EG2001X makes it easy to set up and execute testing procedures. It has a wide selection of diagnostic and process management tools that simplifies wafer probing and testing. The machine provides various measurement options, such as flash, fine-pitch, swell, overdrive, voltage, timing, and parametric test. EG EG2001X comes with an Open Test Architecture (OTA) feature that allows for testing of different devices in one process. It also features an auto-calibration routine that helps to reduce the time needed for probing. An extended software library is also available for specific probing solutions. 2001X is an excellent choice for applications requiring high accuracy and reliable wafer probing. The high-precision, automated prober delivers straightforward operation and yields reliable results. It is well suited for applications such as IC/System level test and programming, package level test and programming, and package level testing for BGA and CSP.
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