Used ELECTROGLAS / EG 4090u #293767779 for sale

Manufacturer
ELECTROGLAS / EG
Model
4090u
ID: 293767779
Prober.
ELECTROGLAS / EG 4090u is a prober created by Electro-Glas, Inc. It is designed for wafer probing, die sorting, and die cutting applications. EG 4090u is a fully-automated machine, capable of producing high quality products with its advanced technologies. Its features include an 8-nozzle array and an automated alignment equipment, as well as an automated data storage system, an automated vision unit, and a fully-automatic defect inspection machine. The machine is also equipped with a wafer grip, a wafer angle adjuster, a vacuum chuck, and a precise motion control tool. ELECTROGLAS 4090 U is capable of wafer probing in a wide range of applications, including fine pitch probing, flip chip probing, and die cutting. The 8-nozzle array ensures precise placement and alignment of the probe needle, allowing for accurate measurements. The automated alignment asset quickly and precisely aligns the wafer for optimum performance. The automated data storage model provides reliable and secure data storage, while the automated vision equipment constantly monitors the alignment of the probe tips. The system is also able to check for defects within the die and cut it automatically if necessary. 4090 U also features a wafer grip which provides secure and tight gripping, enabling a precise motion control. The wafer angle adjuster controls the angle of the wafer and helps to ensure the accuracy of probing. Furthermore, the machine is equipped with a vacuum chuck which helps maintain a stable environment throughout the probing process. Overall, EG 4090 U is an advanced piece of prober technology. It is designed with a combination of advanced technologies and features, ensuring a reliable and accurate performance with every use. Its characteristics provide improved accuracy and automated data storage, while its vacuum chuck and wafer grip ensure a high-quality output. As a result, ELECTROGLAS / EG 4090 U is an ideal solution for wafer probing, die sorting, and die cutting applications.
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