Used ELECTROGLAS / EG 4090u #9230524 for sale

ELECTROGLAS / EG 4090u
Manufacturer
ELECTROGLAS / EG
Model
4090u
ID: 9230524
Wafer probers Chuck type: Hot chuck Ambient temperature: Up to 130°C Chuck top assy type: Gold / Silver Tester: Spyder, magnum, MAVERICK tester for wafer, 6" Docking tester, 12" Operating system: MS-DOS Probe to pad alignment: Manual and auto alignment Missing parts Power: 115 / 230 V.
ELECTROGLAS / EG 4090u prober is a high precision probing equipment made for measuring electrical characteristics of thin film and other electronic materials at both the device and wafer level. It is designed for testing components with a checkerboard pattern or small pads of up to .6mm in size. The system's high accuracy and repeatability is necessary for characterizing small device structures and performing small-scale electrical measurements. The prober is equipped with a wafer stage motorized by a closed-loop servo unit that can scan from a uniform point-to-point at any given angle with a maximum particle size of 5-micron. It also features precise leveling control with an automatic wafer load/unload mechanism. The machine also provides reliable wafer transfer, and barcode reader for sample identification. EG 4090u also offers a wide range of electrical testing capabilities utilizing the optional in-head resource kit. It provides good compliance of the tester head to the wafer surface, along with a broad range of test solutions for different device measurements. These include precision current/voltage measurements, resistance measurements, and capture/analysis of transient signals and waveforms. The tool also offers a fully automated wafer-level test solution, called Hotstage™, for testing multiple devices on adjacent die simultaneously. Hotstage™ provides both dry contact and electro-air-gap solutions for the testing of non-conductive devices, and temperature-controlled measurement of large die. ELECTROGLAS 4090 U's innovative design and superior accuracy allows it to be used for asset-on-chip (SoC) testing and packaging, flip chip, optical die packaging, and die-down testing. Its well-defined probing method eliminates damage to fragile parts and provides measurements with extreme accuracy and repeatability. The entire model is designed to be adjustable and portable, allowing for quick and easy equipment reconfiguration and setup. Its high speed and automation features reduce test times for quality assurance of devices, resulting in higher throughput and lower cost.
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