Used INNOBIZ IZ-WPS 5001 #9379294 for sale

Manufacturer
INNOBIZ
Model
IZ-WPS 5001
ID: 9379294
Vintage: 2010
Probers / Sorter 2010 vintage.
INNOBIZ IZ-WPS 5001 is a prober designed for high performance probing on wafer or packaged devices. It is an ideal solution for measuring bump height, height uniformity, low voltage probing, wafer checking, 3D profile, mobile phone probing, flip chip/router/peripheral beads inspecting, and other non-destructive testing applications. IZ-WPS 5001 is equipped with a two-axis motorized stage that enables precise X-Y-Z positioning. The motorized vibration reduction feature ensures low noise operation and a long-term stable accuracy. The prober offers a wide measuring range and high accuracy. The prober ensures a secure sample handling, stable vertical performance, and accurate stage motion. INNOBIZ IZ-WPS 5001 has an intuitive interface and measures beyond the limits of what a normal testing application can achieve. It features a powerful and flexible software package with customizable settings for repeatable equipment results. It is equipped with an advanced color LCD touch screen for easy data visualization and entry. The user has complete control over the operation of the unit through programmable buttons. IZ-WPS 5001 is equipped with a low noise laser encoder for accurate movement of the percussion stylus, and an automated bellows based clamping equipment for securing wafers, packages packages, and substrates to the stage. This system also features an automated wafer chucking unit for easy removal and loading. The prober also has a unique vision-based analysis machine that performs automatic 3D profile and height measurements. This tool is capable of inspecting a full wafer at once, or selectively inspect only certain areas with further flexibility. Finally, the prober is equipped with a choice of air bearings and linear motors for extremely efficient acceleration and deceleration rates. All these features ensure that INNOBIZ IZ-WPS 5001 is the perfect tool for high precision wafer and package probing.
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