Used KARL SUSS / MICROTEC PA 300 #9112054 for sale

KARL SUSS / MICROTEC PA 300 is a full-featured bi-directional prober designed for wafer testing and probing. It is capable of probing up to three sites at a time on a single die, with a maximum wafer size of 8 inches. The equipment is made up of four major components: a prober base, an embedded PC-based controller, a vision system, and an X-Y prober stage. The prober base supports the prober head and the vision unit and includes the motion control machine and the Z-axis positioning tool. The motion control asset is responsible for providing positioning and vector control of the X-Y stage, while the Z-axis positioning model is able to provide precise Z-axis control for the head and vision equipment. The prober head is designed to be compatible with various probe cards for wafer and IC testing, offering superior accuracy and repeatability when positioning the probe across a wafer. The embedded PC-based controller on MICROTEC PA 300 has a Windows-based operating system, providing full user control of the unit. It also includes a graphical user interface and programming language to allow for easy programming of the prober. The controller also offers the option to control the prober remotely, meaning users can connect to the interface and perform wafer testing and probing remotely. The vision machine on KARL SUSS PA300 provides users with full vision capabilities, allowing them to inspect wafers and dies for defect analysis. It also features a software-driven image analysis tool, to enable users to quickly identify and analyze wafer defects. Finally, MICROTEC PA300 includes a sensitive X-Y prober stage capable of providing dynamic positioning and random access scanning, allowing users to accurately positioning the probe across the wafer and collect data from multiple points of the die. The stage also features a high-resolution asset that makes it easy to measure the topography of a die and assist in verifying a successful probe contact. Overall, PA300 is a highly capable bi-directional prober designed for wafer and IC testing. It features a combination of a prober head, embedded PC-based controller, and vision model, along with a sensitive X-Y stage, to provide users with a reliable equipment for probing a wafer and collecting data.