Used MPI-FC LEDA-8S EVA-3G-110 #9181611 for sale

MPI-FC LEDA-8S EVA-3G-110 is an advanced optical prober designed for probing a wide variety of semiconductor wafers, substrates, and packages. It is equipped with high definition optical systems that can be used to detect extremely small defects, structures, and features on the surface of a wafer or package. The LEDA-8S prober is optimized for wafer level Burn-in, off-axis imaging, and backside illumination measurements. LEDA-8S EVA-3G-110 is designed specifically for advanced semiconductor probing applications. The prober has an integrated 40 megapixel digital camera, allowing imaging even of the most microscopic defects and structures with resolution up to 5 nanometers. The LEDA-8S is equipped with a powerful XYZ articulated scanning arm. The arm can be independently programmed to move across multiple axes in small increments, allowing scanning of the entire wafer surface quickly and with high accuracy. It is also equipped with a high acceleration, low-force scanner allowing the scanning of features up to 0.5mm in size without damaging delicate structures. The prober also includes an automated test equipment. With the push of a button, users can perform automated tests such as Burn-in, package verification, and failure analysis on the wafer or package. The test results can then be immediately reported and analyzed in order to adjust the process accordingly. The LEDA-8S prober is also backed by a wide variety of features and software that makes it extremely easy to use. It has an automated wafer centering system, allowing it to be programmed to center itself on most wafer sizes without manual intervention. It also has an intuitive software interface that is designed to be both user friendly and customizable, allowing users to select their desired setup parameters and run their tests with maximum efficiency. Overall, MPI-FC LEDA-8S EVA-3G-110 is a powerful and versatile prober, suitable for a wide range of advanced chip probing applications. Its integrated advanced optical systems and test unit allow users to quickly and accurately detect and analyze defects, structures, and features on semiconductor wafers, substrates, and packages. Its intuitive software and automated wafer centering machine make it extremely easy to use, while its low-force scanner ensures that delicate structures are safely scanned.