Used MPI LEDA-8F-E3G #9181640 for sale

MPI LEDA-8F-E3G is a prober for wafer probing and testing production. It is a fully-automatic, motorized prober that is capable of probing both bumped and bumped-pad lengths. It is designed with a sophisticated closed-loop servo system which ensures high precision probing and precision pad-to-pad measurements. LEDA-8F-E3G is suitable for use in a variety of applications, including application-specific integrated circuits (ASICs), microcontrollers, memory devices, and RF/microwave devices. MPI LEDA-8F-E3G features eight independent prober arms, each capable of independently controlling its motion and speed. It is also equipped with an adjustable probing head and probe cards, which enables it to accurately probe even non-conforming material providing excellent yield and performance results. Additionally, the robust mechanical design of LEDA-8F-E3G prober delivers reliable, precision scanning results, giving users the confidence that devices are consistently tested and at an acceptable quality level. MPI LEDA-8F-E3G also includes several advanced features that give users further control over the probing process. These include the ability to control multiple probing arms at once, allowing users to test more than one device at a time. Furthermore, the probing station includes a high-resolution graphic LCD display, which allows users to easily visualize and monitor prober performance and progress. In addition, LEDA-8F-E3G is equipped with multiple I/O ports so that it can be easily connected to a host computer for semiconductor fabrication and testing. It also offers different modes of operation, allowing it to be used in a variety of environments, including production and laboratory settings. Finally, MPI LEDA-8F-E3G is designed for use in probe stations with multiple power supplies, giving it the flexibility to be used in different conditions. Overall, LEDA-8F-E3G provides users with a reliable, high-performance prober that is capable of precisely probing and testing a variety of devices. Thanks to its advanced features and flexible operation, it is an ideal choice for use in semiconductor fabrication and testing applications.