Used MPI LEDA-8F #9215467 for sale

MPI LEDA-8F is a high-precision automated prober specifically designed to enable a wide range of testing applications on wafers up to eight inches in size. It is ideal for both research and industrial applications when testing electrical performance of ULSI components, OLEDs, MEMS and other components in the microelectronics industry. LEDA-8F was designed to provide reliable automation and accuracy for semiconductor probe testing. It features a precise, three-dimensional, linear motor motion equipment and a built-in vision system to ensure accuracy. It also has a high-resolution, long-range structure leveling unit and an optical stage that allows for non-contact alignment of sample and probe cards within 0.5 microns accuracy. MPI LEDA-8F has an automated probe needle changing machine with no mechanical moving parts that provides stability and fast needle changing times. The needle feature is ideal for high-throughput applications by reducing setup time and increasing availability. The prober's advanced needle handler offers precise tip replacement and efficient repeatablity, for applications such as scan applanation and TAS measurement. The prober can be tailored to specific applications through a range of additional options available, including a wide range of customized probe cards, as well as automated metrology and sorting systems. The built-in vision tool provides an easy-to-use image acquisition asset for automatic wafer inspection and quality control. LEDA-8F is equipped with advanced model control software which supports both the visual-guided image processing and error correction. The software also features detailed process recipes, process editing and analysis functions, enabling simpler and more efficient process automation. Overall, MPI LEDA-8F is an efficient and reliable prober specifically designed to enable a wide range of testing applications in the microelectronics industry. It is ideal for both research and industrial applications when testing electrical performance of ULSI components, OLEDs, MEMS and other components. It is equipped with advanced control equipment software, a precise three-dimensional motor motion system, a built-in vision unit, an automated probe needle changing machine, and a range of additional customizable options to suit individual testing requirements.