Used QMC DPS 600 #9379310 for sale

QMC DPS 600 is a prober designed for testing multi-chip modules (MCMs). It is a fully automated wafer prober that offers high throughput, precision, and accuracy. It is capable of testing up to 6000 mm MCMs with a cycle time as low as 0.7 seconds. It boasts a multitude of features, including a large working envelope, an integrated electrical contact checking system, an ability to interface with multiple test systems, and a robust design and structure incorporating precision motor drives, linearizing encoders, and linear motion guide rails. DPS 600 is designed to handle a variety of different testing methods, including a wide range of manual or automated contact and non-contact measurements. Its integrated vision system enables a vast variety of measurements to be taken, including optical fault and die sorting, package optical thickness, fiducial mark scanning, and inspection of solder joints. It is also capable of testing MCMs that are made up of components from different semiconductor processes. QMC DPS 600 offers a high degree of environmental control, including temperature and humidity settings. It boasts a high level of precision, accuracy, and repeatability with an accuracy of 3 micron or better. Its low vacuum setting allows for better die quality control, while its ceiling-mounted loaders makes manual loading of test wafers or carriers easier and faster. It is also capable of accommodating many different types of carriers, including carriers with up to eight (8) die rows. DPS 600 is manufactured with an easy-to-use PCI graphical user interface, which allows for the control of several different functions including wafer movements, operations, and environments. The user can also view real-time parameters and settings. Furthermore, the PCI PCI-X interface is designed to provide more stable access to the display and controller. QMC DPS 600 is an excellent choice for those looking for an automated prober solution that is accurate, efficient and cost-effective. Its simple user interface, advanced features, and robust design make this a great choice for any type of multi-chip module testing purposes.