Used SEMICS OPUS 2 #9209475 for sale

SEMICS OPUS 2 is a leading prober for semiconductor applications. It is designed to meet the demands of device testing and engineering. It utilizes probe cards and full turnkey probing solutions to facilitate the testing of complex integrated circuit (IC) packages. The features of SEMICS OPUS2 include multiple precise and versatile probing capabilities, superior accuracy and repeatability, and superb flexibility in handling and dimensions. OPUS 2 is equipped with automated functions such as calibration, pad inspection, and packaging speed handling. It provides a complete solution for probing active and passive components. OPUS2 is designed with users in mind, ensuring easy access to all features and settings. It includes an intuitive GUI that can be easily operated with a few clicks. The system is designed with an advanced user interface that is easy to use and navigate. The integrated software suite provides reliable performance and accurate measurements. It is equipped with all necessary features for accurate and repeatable probing. SEMICS OPUS 2 utilizes advanced auto-leveling sensors for accurate, repeatable, and fast-response testing. It utilizes five main probe cards, multi-level pogo pins, and different types of contact probes for various probing jobs. The probe cards are designed to enable faster bed of nails applications. The multi-level pogo pins enable more durable connections and increased accuracy. It also supports various probe card stack configurations for practical probing. SEMICS OPUS2 also includes advanced wafer-level testing certifications to ensure quality and reliability. The advanced wafer-level certification programs allow for faster and more accurate testing results. The system is rugged and reliable, and its advanced features can offer stable operation through extreme temperature and humidity conditions. It also supports multiple calibration setups and spoofing option to ensure quick and accurate measurements. OPUS 2 is a reliable and accurate prober that is ideal for advanced IC packages and pad testing. It is easy to use and includes features such as automated calibration, pad inspection, wafer level certifications, and spoofing option to deliver precise measurements and faster testing results.