Used SEMICS Opus II #9407025 for sale

SEMICS Opus II is an automated prober equipment designed for wafer probing, component sorting and die pre-bonding. It utilizes a combination of mechanical and electrical functions, high precision and automation to provide reliable and repeatable results in a variety of wafer-processing applications. The system consists of a base station, an operator console and four positioners, as well as independent probing/sorting/handling chambers. The positioners can accommodate 250 to 590 mm diameter wafers, up to 4.7mm thick, with adjustable tilt and height. They can also handle wafers larger than the physical prober size, allowing for efficient probing on the largest wafers available. The base station houses the vertical and horizontal motion controls for the positioners, allowing for precise movements and positioning with speeds up to 10m/s. The positioners are equipped with a CCD camera with real-time image and defect recognition as well as a laser range finder for die alignment. The probing unit provides high accuracy measurements with a resolution of 0.5um. It is equipped with a dual probe head, which allows simultaneous scanning of both sides of the wafer and re-use of the same head for multiple applications. A pick-and-place tape handling machine allows for wafer handling and die sorting. The tool supports a wide range of probe card configurations, including partial and full column contact, standard and reticle contact, 3 and 6-contact, 1 and 2-finger, and programmable contact. The rods used can accommodate different angle, width and length, as well as varying contact force. The software allows for custom test program development by the user, and supports multiple languages, like C, C++, and FORTRAN. The asset has an all-in-one optical, electrical, and mechanical isolation model for noise immunity, ensuring the highest measurement accuracy. Additionally, the equipment itself is vibration and shock resistant and suitable for harsh industrial environments. In conclusion, Opus II is a robust, reliable and repeatable prober system, with a range of features for wafer probing, component sorting, and die pre-bonding. It enables high accuracy measurements, through a combination of mechanical, electrical, and optical functions, and it is suitable for use in the toughest of industrial environments.