Used SEMICS Opus III #293731361 for sale

Manufacturer
SEMICS
Model
Opus III
ID: 293731361
Vintage: 2011
Prober 2011 vintage.
SEMICS Opus III is a powerful prober for testing semiconductor chips and other electronic components. It is a multi-channel analyzer, incorporating multi-channel wafer probing and on-wafer testing capabilities. The prober provides high accuracy and efficiency and is ideal for testing critical parameters such as validation, test and production yield. Opus III includes a range of features including multi-channel wafer probing, RF probing and optical probing. Its advanced multi-channel probe system feature includes high resolution probes for probes across any size of semiconductor devices. It also offers an adjustable precision alignment system for precise handling of fragile chips and for accurate probing. Moreover, SEMICS Opus III also features a unique auto-calibration system which speeds up probing by automatically detecting and calibrating the probe head positions. Opus III also boasts an impressive range of on-wafer testing capabilities. Its advanced on-wafer testing techniques ensure accurate and repeatable measurements, even when probing very small devices or complex structures on the same wafer. This allows for short testing times and improved throughput, reducing the risk of costly process errors. The automated wafer map features enable efficient floating or fixed wafer remapping. Also, SEMICS Opus III allows simultaneous testing of multiple chips and provides user-friendly software, including fast data visualization and real-time analysis. For additional flexibility, Opus III is available with an option for integrating laser thermal processing for testing at wafer-level. Overall, SEMICS Opus III prober offers an advanced platform for semiconductor testing and validation, ideal for a wide range of applications including production testing, reliability testing and advanced engineering projects. It is a reliable, efficient and accurate tool which provides high quality testing results, reducing cost and improving throughput.
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