Used SEMICS Opus III #9251173 for sale
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ID: 9251173
Vintage: 2017
Prober
Includes:
Hinge
Hot temperature
ND4 Docking
2017 vintage.
SEMICS Opus III is a high-performance prober designed for semiconductor wafer testing and probing. It features a modular design, which allows for integration of various components, such as vision modules, reliability modules, and so on. The prober is well suited for probing test structures and conducting electrical tests, allowing efficient testing and reliable data collection. Opus III prober is composed of two major parts: the measurement head and the control unit. The measurement head consists of an automated 3-dimensional prober arm, a wafer rotation platform, and an X-Y motorized stage, as well as a vacuum system for holding the wafers. These components allow for high-precision measurement of small devices. The control unit includes the integrated performance test and operation module. This module controls the operation of the prober and stores data acquired from the wafers. The prober has a wide array of features, such as a high accuracy performance, repeatability of measurement, high stability, and a fast probing cycle. It is designed to support a range of wafer sizes and thicknesses, as well as a variety of probing technologies, such as eddy current, resistance, capacitance, voltage, current, and time domain. It is also compatible with various package types and sizes, such as TSOP, QFH, PGA, and pin grid arrays. SEMICS Opus III provides a number of useful functionalities. Its auto-staging calibration system ensures precise and consistent wafer placement and measurement, while its multi-directional motion control system allows users to quickly change settings and modify parameters. Moreover, an embedded relay module helps support different voltage requirements and provides multiple channel probing. Overall, Opus III is a powerful and reliable prober for semiconductor wafer testing and probing. Designed to be fast and effective, it features a modular design and is equipped with a variety of high performance capabilities. It can accurately and quickly measure various wafer types and test structures, while providing reliable data collection for efficient testing and analysis.
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