Used SEMICS Opus3 #155756 for sale

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Manufacturer
SEMICS
Model
Opus3
ID: 155756
Wafer Size: 6", 8", 12"
Wafer prober, 6", 8", and 12" Basic specifications: Wafer size: 6", 8", and 12" wafers Accuracy: ± 1.5µm Card changer: 350 to 480mm Temperature range: -55 to 200°C (with ambient control) Chuck force: 300kg Index time: 200msec (5 x 5x x 0.5mm) Auto cassette loader available in 3 configurations: Flat top loader Top loader Dual FOUP loader Features: Smart Probe card Alignment (SPA) Mechanism Intelligent Overdrive Control 6", 8" & 12" Wafers without Mechanical Changeover Superior Tri-Temp. Control (Cold/ Ambient/ Hot) Flat Top for Large Test Head Easy On-Site Calibration Fast Index/ Less Vibration Fastest & Simplest Auto Card Changer Fast Linear Motor Control for XY Stage Z-Down Control at the Time of Power-Down 200x100 Needle Cleaner CCD Camera Cassette Mapping for Thin Wafers High-Performance OCR SECS GEM Compliance.
SEMICS Opus3 is a prober equipment developed by SEMICS Incorporated. It is designed to be used in the production of semiconductor devices in the fab environment. The system combines various measuring instruments, such as laser interferometers, metrology systems and a force sensor, with sophisticated software that can be used to collect data and to perform advanced data analysis. SEMICS OPUS 3 prober unit is a versatile and highly advanced machine which is suitable for a wide range of applications including die-arrival test and map-parts analysis, kinematics and dynamic analysis, optical microscope (OM) test and measurement, and probe card performance test. It is also used for wafer level testing such as parametric testing and failure analysis. Opus3 prober tool is equipped with a beam monitor asset that enables the user to take accurate data recordings of wafers. The model also features a laser interferometer for measuring the distance between the prober and the wafer. Additionally, a fully automated alignment and focus equipment is included, allowing the user to quickly and accurately adjust the alignment and focus of the prober system. OPUS 3 also includes a force sensor that allows the user to measure the contact force between the prober and the wafer. Additionally, the unit includes an integrated metrology machine which consists of image processing and data acquisition capabilities that can be used to collect data during wafer testing. The control tool for SEMICS Opus3 prober is very intuitive and easy to use. The user can control the prober and its functions by issuing commands via a user-friendly graphical user interface. It also has the ability to customize its own test program and control parameters according to the user's specific requirements. In addition, the control asset allows the user to modify its program according to changes in the wafer testing environment, ensuring that accurate and reliable data is collected during testing. In conclusion, SEMICS OPUS 3 prober model is a truly versatile and advanced equipment that is suitable for a wide range of applications. It incorporates a variety of measuring instruments and advanced software to enable the user to effectively and efficiently collect data and to perform data analysis during wafer testing.
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