Used SEMICS Opus3 #9068355 for sale

SEMICS Opus3 is an advanced prober platform developed by SEMICS which enables efficient wafer probing to measure and analyze the electrical characteristics of integrated circuits (ICs). The equipment offers high performance and user-friendly operations to quickly identify defects in ICs and to optimize their designs. SEMICS OPUS 3 utilizes the latest advancements in prober technology, including fully computerized probing, automated die-to-die comparative testing, and multi-die scanning capabilities. It also enables the automatic positioning of chucks, as well as the automated loading of wafers into the probe heads. As a result, Opus3 is able to achieve quick measurement of ICs, as well as to differentiate between die and sub-die parameters. The high precision of OPUS 3 enables the user to not only perform dark and bright-field imaging to quickly identify ICs defects, but also to detect subtle changes in electrical parameters. The platform utilizes a CCD camera to displays the IC's surface information in a variety of image formats such as SEM and TEM images. SEMICS Opus3 offers an advanced control system which enables the user to adjust IC parameters during probe operations. By utilizing Parameter Manager and Probe Program Manager software, the user is able to adjust the IC conditions for highest signal-to-noise ratio and highest test speed. The user is also able to parameterize probe recipes and to update dies parameters instantly with fixed parameters or customized recipes. In addition, the platform offers a variety of measurement options, such as on-wafer testing and wafer mapping, which allow the user to obtain various electrical measurements while comparing ICs at multiple process nodes. The unit's software also allows users to set probing pattern parameters, including auto-recalibration and auto-waveform measurement capabilities. Overall, SEMICS OPUS 3 is an advanced prober platform that offers a wide range of features to quickly identify and test ICs. The platform offers multiple measurement options, automated probe operations, and CCD camera support for high performance defect detection. The machine also offers an advanced Parameter Manager and Probe Program Manager for a customizable and efficient operation.