Used SEMICS Opus3 #9223053 for sale
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ID: 9223053
Wafer Size: 8"-12"
Vintage: 2015
Wafer prober, 8"-12"
Linear stage system
Foot print with flat top
Cassette map with camera
GUI Based on windows
Wafer change & index time
Soft contact for low "K" device
VNC Support
Probe mark inspection
Main body: Ambient and hot (Up to 150°C)
System interface: GPIB
Stage:
FOUP: 12"
Chuck: 12" (Hot chuck)
OCR Unit: SEMICS OCR
Auto card changer: 480 mm
Card holder: 350 mm (Steel holder)
Needle clean unit: 200 mm X 100 mm Ceramic plate (Load 30Kg)
Alignment camera: Macro camera
Loader:
Arm: Arm 1,2
Rotation unit: 360° Turn table
Elevator unit: Stroke AC servo motor, 330 mm
Wafer recognition unit: Camera
Fixed tray: Tray 1, 2
Inspection tray: Tray 1
Computer:
CPU: Pentium 4 4.2 GHz
HDD: 80 GB
Memory: 2 GB
Monitor: 15" (Touch monitor)
Operating system: Windows XP
Basic function:
PMI
PTPA
PTMA
PTPO
Needle polish
OCR
X,Y Stage:
Overall accuracy: ±1.5 μm
Probing area X,Y: ≤165 μm
Maximum speed: 300 mm/sec
Index time: 160 msec/10mm
Resolution: 0.035 μm
Z Stage:
Control accuracy: ±1 μm
Resolution: 0.18 μm
Full stroke: 30 mm
Speed: 50 mm/sec
θ Axis:
Rotation range: ±6°
Accuracy: ±0.0002°
Resolution: 0.0025μm
Wafer handling:
Thickness: 180 μm to 2000 μm
Die size: 350 μm to 100000 μm
Chuck:
Planarity: 15 μm
Temperature range: Ambient to +150°C
Temperature accuracy: 100°C : 0.5°C
Computer:
CPU: 15 Dual core 2400 3.0GHz
Storage memory:
HDD: 500 GB
RAM: 3 GB
Utility:
Air pressure: Above 0.5 Mpa, 100 Liter/Min
Vacuum pressure: -70 Kpa ~ -100 Kpa, 20 Liter/Min
Air vacuum external diameter tube: Ø6 mm, 1 Line
Power: 200 ~ 240 VAC, 25 A, 1 Phase, (3 Wire), 50/60 Hz
2015 vintage.
SEMICS Opus3 is a Versatile Prober that is developed to support testing and probing of various device packages such as DC, logic, and power devices. It is designed with multi release head configuration enabling simultaneous probing of up to four side or up to three layers. Optimal performance is also assured with the help of a high precision head alignment. Made with an open frame architecture, this prober is also able to effectively support a wide range of processes within a small area or footprint. High stability can also be achieved when testing at high temperature since the thermal expansion compensation feature is included. SEMICS OPUS 3 comes with a variety of test handlers to choose from such as its Multi-Handler, Multi-Handler-GT, Multi-Handler-FL, and Multi-Handler-GPL. Other features that are included in this prober are the pneumatic-controlled Vacuum clamping, proprietary image-processing enabled vision-alignment, and a highly accurate collision-free Z-manipulator. Furthermore, Opus3 is also capable of acquiring orientation information from IC chips that use a contact pointing technology with its Source Orientation Recognition function. Apart from its regular functions of testing and probing, this prober is also equipped with a variety of software for facilitating device programming and testing. These include Optic InstruX (OIX), Tools for Probing & Testing Optimization (TPTO), Network Support Tool (NST), Prober Level Remote Interface Tool (PLRIT), Equipment Setup Tool (EST) and several others. Moreover, a series of accessories such as probes, chuck adapters, vision modules, and interposers are also available for better control and operation. With all of these features, OPUS 3 proves to be an ideal solution for efficient and effective testing of various device packages. From probing, testing to programming, all operations can be performed with maximum accuracy and speed.
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