Used SIGNATONE CM-170 #9363189 for sale

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SIGNATONE CM-170
Sold
Manufacturer
SIGNATONE
Model
CM-170
ID: 9363189
Wafer Size: 8"
Probers, 8" Temperature: Ambient.
SIGNATONE CM-170 prober is a probing equipment designed for accurate electrical measurement of integrated circuits. Designed for a range of technologies such as bipolar, MOS, BiCMOS, and CMOS, the system combines a full-featured microprocessor-controlled prober with contact checking and kelvin probing capabilities. It provides accurate electrical measurements up to 8GHz, allowing the user to access and measure signals on high-performance integrated circuit structures. The prober consists of a compact, ergonomic base, a conventional chuck, a card-based processor, and up to two optional kelvin probes. The base includes a pneumatic positioning unit for wafer or die scanning and calibration, an automated panel exchange machine, and a sample holder accommodating single die or wafer probing. The chuck on the prober is demolded for easy access to components and facilitates external cable connections. It also ensures low thermal conduction of the sample during the probe operation. The processor provides intelligence for the SIGNATOME CM-170 prober, and provides interactive control over all the components. It features a variety of PC-based applications for performing measurement tasks, as well as probing and trajectory control. A serially programmable, graphical interface enables fine tuning of measurement and positional parameters. The processor also features an automated wafer alignment tool for properly positioning the sample. The optional kelvin probes allow the user to perform high-accuracy, low-noise contact measurements. These probes feature electronic compensation circuitry for temperature drifts and an integrated pressure sensor that simultaneously takes force and sample temperature readings. This allows the user to perform a range of measurements in various environments. SIGNATONE CM-170 prober has been designed for use in production and laboratory environments. Its capabilities are suitable for a variety of applications, such as wafer delay testing, relative spread testing, memory testing, and function testing. The asset's integrated features make it an excellent choice for electrical testing of today's high-performance integrated circuits.
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