Used SIGNATONE S-1000 #9181257 for sale

SIGNATONE S-1000 is a full-featured prober designed with both die and package level testing in mind. This equipment can handle both manual and automatic probing and includes an embedded laser source for critical measurements. It combines a high-resolution CCD camera with an image forming projector, providing highly accurate probe placement. The automated microscope and video inspection ensures accurate marking of defects and a wide field of view. S-1000 utilizes an air bearing cross-slide to slide the probes to and from the DUT without damaging it. This design also ensures accurate alignment and positioning, while allowing exceptionally smooth motion along the x, y, and z axes. This system also incorporates a multi-pin recognition unit for handling up to 256 dots simultaneous probing. The probing performance is further enhanced with linear, pattern, and dynamic probes. The prober is highly capable of complex tests, with visibility of up to 300um or higher, it can easily detect even the smallest defects on the DUT. Additionally, the machine can easily measure capacitance and provide impedance measurements up to 210 MHz. The tool also offers easy integration with external test systems, allowing automated data integration and analysis. SIGNATONE S-1000 is also designed to be used in an imaging asset or machine, allowing for automated inspection of the probe locations and the finished product under a microscope. This model is also equipped with a 6-axis robot arm that can pick up to 35 tools from pre-programmed storage banks. The powerful probe electronics of S-1000 can handle data collection from up to 32 channels with compliance measurement, logic, switching, and data analysis features. The equipment also allows for up to 120Msample/sec single scan rate or up to 500Msample/sec aggregate scan rate. Overall, SIGNATONE S-1000 is an advanced prober suitable for a variety of applications. With its highly accurate probe placement, fast data collection, versatile 6-axis robot arm, and easy integration with external test systems, this system offers a reliable and efficient solution for die and package level testing.