Used SPEA 4060 S2 #9282914 for sale
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ID: 9282914
Flying probe tester
With bottom side moving head
Working hours: 100
P/N / Description
4060s2M BU500 / 4060s2 Manual loading base unit, (4) top moving heads
LCK 230 / Board locking mechanism, automatic lock (12 clamps), automatic width adjustment set
YAICT 320FP / Motor for BSMH, for 4060s2 M
L2FLY R120 / ICT Instruments unit, dual 4 quadrants DC source ±10V/±100mA, ±50V/±100mA, DVM
L2BP R120 / Leonardo OS2 FLY Execution
AS 6 / Leonardo OS2 Backplane
JCS 10 / Test area extension to 686 x 600 mm (27x23"), top side, BSMH compatible with system setup
OPS 450 / Open pin test, junction scan
OPS 550 / Open pin test - Electroscan on axis 1 & 4 top
OPS 560 / Open pin test - Electroscan on axis 5 bottom side moving head
ESV 100 / Open pin test - Electroscan on axis 6 bottom side moving head
PRT 60 / Electrical & pneumatic energy saving function
DK 115 / Internal graphic printer, 24 lines/sec, USB
HLD 11 / Base diagnostic tool for FP s2
PRD USA S2 / Stand for monitor, keyboard and printer
MSD 120 / Standard system pre-configuration, for 4060s2
SPS 15 / Motorized sliding door, for 4060 M/SL
AUS 10 / System power supply, three phase, 208V, for FPs2
CTI 310 / Auxiliary AC sockets, qty 3, 220V, CE
BSMH 261 / Connector tester interface, up to 576 TP, for 4060s2
PKB 400 / Bottom side moving heads, 2 heads, optical alignment module with color camera, for LCK 200 series
YASCA 64EC / 2x Linear Z axes for bottom side moving heads, for 4060s2
STO 100 / Analog matrix, 64ch, 4/8rows, 120V, 1A, extendable with digital channels, external connection, test interface, for FPS2
LEO2 GOLD FLY / Resistance short test
SSD 20 / Leonardo OS2 Suite Fly - Gold - R1.10
1SM 100 / SPEA dongle for LAN installation
OPT 400 / Call center support
LTM 100 / Automatic optical inspection, alignment, rotation, presence, optical character verify
LTA 100 / Laser test module, Accuracy 0.01mm, Spot Ø 0.07mm.
SPEA 4060 S2 is an automated semiconductor wafer handling prober. It is designed to meet the needs of test and burn operations for integrated circuits, with a focus on ICs with medium to high-density contacts or fine feature resolution. 4060 S2 features a dual-axis design, with a wafer-handling arm that travels along the long axis of the prober and a contact arm that moves along the transverse axis. This dual-axis system allows precise positioning of the contact arm to ensure accurate probing. The prober is also equipped with a pattern recognition capability that allows for efficient alignment of the wafer to the contact arm. This advanced feature allows for easy switching between different wafer sizes and shapes. Furthermore, SPEA 4060 S2 is designed with integrated pass/fail reporting capabilities to improve efficiency in production line testing. The prober also comes with advanced safety features to ensure that the process is performed safely and accurately without harming the complete process. The prober is equipped with touch-safe switches, which means users can suspend the wafer movement to reduce the chance of contact errors or other operator-related faults. Additionally, 4060 S2 also features an electromechanical safety gate that activates when it senses a potential contact. In terms of performance, SPEA 4060 S2 can perform probing operations at speeds of up to 5 milliseconds per contact point. The prober's design also allows for a maximum of 4.0mm peak-to-peak calibration accuracy, giving it excellent accuracy in measuring individual contact points. Additional features of 4060 S2 include a wide range of force control parameters, allowing users to adjust the force used to make contact with the wafer so as minimize damage to the integrated circuit or wafer. Overall, SPEA 4060 S2 is a versatile and accurate semi-conductor wafer handling prober, perfect for medium- to high-density contact testing. With its advanced pattern recognition, pass/fail reporting capabilities, safety features and high-performance capabilities, it is an excellent choice for test and burn operations.
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