Used TAKAYA APT 9401CJ #293830553 for sale

TAKAYA APT 9401CJ is a highly advanced, evolutionary prober designed for the inspection of BGA and flip chip packages. The 9401CJ is based on the original 9400CJ and offers many advanced features to verify pad connection with high accuracy. It achieves this through key features such as mirror imaging, non-contact scanning and electrical test probing. Mirror imaging is used to inspect the joint between the ball grid array and the underlying chip to ensure proper electrical connection. This works by comparing an image of the package to an ideal or "known good" image, and any abnormalities can be easily detected. This feature is particularly effective for detecting incorrectly soldered joints or small cracks. Non-contact scanning is used to achieve a higher level of accuracy than mirror imaging. This technique ensures that the prober uses precise movements to scan the area of the package and accurately detect any potential anomalies. This is especially useful when looking for a loose or missing connection, as any contact with the package could cause further damage. Finally, the 9401CJ features an electrical test probing system to examine the package's electrical integrity. This works by injecting a voltage across the package and measuring the resistance of the connection. This method is quite effective in detecting short circuits, open circuits and low or high resistance associated with poor connection. All these features combined make the 9401CJ a highly versatile prober ideal for the inspection of BGA and flip chip packages. With its easy to use interface and precise results, it is no wonder why it is becoming the industry standard for BGA and flip chip inspection.