Used TEKTRONIX TCPA 300 #9170317 for sale

TEKTRONIX TCPA 300 is a high-performance prober designed for advanced wafer probing applications and integrated circuit testing. It offers a modular design that allows users to customize their prober configuration for maximum performance and efficiency. The equipment is built with integrated computer control, a high-resolution wafer alignment system, and a precision test head for increased probe accuracy. TCPA 300 delivers exceptional performance and operational flexibility for applications ranging from small-geometry probing to large-scale microelectronic package testing. The prober has a modular, configurable design that allows users to tailor its features to their specific testing needs. The main components of TEKTRONIX TCPA 300 include a motion control unit, a precision test head, an IR vision machine, and a high-torque wafer positioning actuator. The motion control tool is comprised of a digital servo amplifier and a multi-axis servo controller, which provide users with precise control of the prober's motions and settings. Multi-axis scanning and probing are also supported, allowing users to quickly move from one specified position to another. The prober's precision test head has a minimum probe pitch of 0.22mm, ensuring accuracy for small-geometry structures. The head also supports a wide range of different probing tips, allowing users to customize their setups to meet their particular probing needs. The asset also includes a high-torque wafer positioning actuator, which ensures consistent positioning of the wafer under the test head. TCPA 300 features an integrated, full-color IR vision model which enhances the equipment's overall performance. The IR vision system allows users to accurately identify probe locations and define boundaries between different test patterns, as well as detect skipped and misaligned sites for improved test results. Overall, TEKTRONIX TCPA 300 is a robust prober that offers excellent performance and precision for advanced wafer probing applications and integrated circuit testing. It features a modular design, a high-resolution wafer alignment unit, and a precision test head for maximum probe accuracy. The machine also includes a high-torque wafer positioning actuator, a digital servo amplifier and controller, and a full-color IR vision tool for improved performance and enhanced test results.