Used TEL / TOKYO ELECTRON 19S #9069026 for sale

TEL / TOKYO ELECTRON 19S
Manufacturer
TEL / TOKYO ELECTRON
Model
19S
ID: 9069026
Probers.
TEL / TOKYO ELECTRON 19S is a prober equipment designed to provide high-level testing and analytical capabilities for integrated circuits (ICs). This system was developed by TEL Limited (TOKYO ELECTRON) and provides complete process uniformity, test and measurement capabilities. The unit can measure a variety of parameters such as die temperature, probing force, contact resistance, IC characterisation, die contact, visual inspection, light illumination, and more. TEL 19S consists of three main components: the prober, the metrology module, and the automation machine. TOKYO ELECTRON 19 S prober is capable of probing ICs in a variety of formats and sizes. The prober handles and positions wafers, substrates, and dices up to a maximum height of 300mm. The prober has multi-axis motion control and is equipped with a high-end, fully digital CCD camera with 12.2 megapixels. It also features a die cooling tool with heaters for uniform temperature control. TOKYO ELECTRON 19S metrology module provides a range of parameters for accurate characterisation of ICs, including die temperature, contact resistance, device order, die integrity, voltage levels, etc. All of the probe parameters can be measured with precision and accuracy of 0.1um or better. The unit has a maximum mechanical resolution of 1 um and is capable of accurately measuring up to 64 pins per die. Finally, the automation asset includes PC control/ data logging software, and is compatible with Windows, Linux, and Mac OS operating systems. It features an intuitive graphical user interface that simplifies job automation and provides users with the power to quickly and easily create and manage metrology programs. The automation model makes it easy to monitor status and performance of the prober, perform periodic calibrations, and measure IC device parameters in an automated environment. In conclusion, 19S is a powerful prober equipment that allows high-level testing and analytics for ICs. This system provides complete process uniformity, test and measurement capabilities such as contact force, device order, and die temperature. Additionally, it is equipped with a precision metrology module and an intuitive graphical user interface. This unit is ideally suited for use in wafer and IC testing and analysis.
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