Used TEL / TOKYO ELECTRON 20SR #9132511 for sale

TEL / TOKYO ELECTRON 20SR is a sophisticated prober for probing wafers for various semiconductor circuits and materials. It utilizes a unique dual-sided scanning equipment with a scanning area of up to 200 mm. It also uses an advanced pattern-matching system which allows users to quickly analyze semiconductor fabrication data and identify defects that need to be investigated further. The prober offers an impressive range of scanning options and advanced features for maximum accuracy and control. TEL 20SR has an XY table on top of the scanner head which allows for a large range of motion and a series of probe tips and systems. The unit uses up to eight different probe systems, including direct and scanning thermography, laser interferometry, and electrical probes. The scanning head is much larger than the XY table, providing optimal scanning speeds and resolution. It also has built-in electrical resistivity measurement systems, which allows users to measure and compare resistance or gain of different materials. TOKYO ELECTRON 20 SR is highly accurate and able to provide detailed visualizations of contact and data points within a wafer. It is also able to map out wiring within a machine and determine connections without damaging to the chip. The laser-beam tool is also capable of scanning through reflective surfaces to examine the underside of the wafer. 20 SR is an extremely efficient prober and is easy to use. It can process a wide range of wafer sizes, so it can be used for both large and small data points. It is also equipped with a host of advanced features, such as multi-axis stepper motors and pattern recognition systems, to ensure maximum accuracy and control. It is built to withstand, low temperatures and humidity, enabling it to work even in harsh environments. 20SR has become an essential part of semiconductor production and design, allowing the probe to rapidly generate complete defect images in the shortest possible time. It has facilitated the rapid advancement of semiconductor manufacturing and has opened up the possibilities for researchers to explore innovative ways of probing wafers for defects and analysis.