Used TEL / TOKYO ELECTRON P-12XL #293605513 for sale
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ID: 293605513
Prober
Missing parts:
Stage motor driver assembly
Loader base box assembly
Loader Z-motor
IOM Board
Arm IOM board
ASU Camera assembly
Bridge camera
Up / Down matching camera - ASU assembly
WAPP Plate
HDD
Theta motor assembly.
TEL / TOKYO ELECTRON P-12XL is a prober designed for highly accurate testing and analysis of wafers. It is the first wafer prober to integrate powerful control software and advanced metrology capabilities. Its components include: a 6-axis precision stage, a 5-stage tip-tilt stage, a 12-axis tilt/rotation stage, and a large independent measurement table. TEL P12XL has an extremely compact form factor, allowing for adaptability to various test environments. It also has an ergonomic design with an intuitive graphical user interface. This facilitates quick and easy operation and helps to optimize testing accuracy. The protractor stage of TOKYO ELECTRON P 12 XL was designed with an integrated high-resolution guide equipment, providing an unparalleled level of precision control. This feature provides repeatable sample positioning accuracies even after extended operation. It also has an advanced die mounting system, which allows for easy manipulation of large wafers and package testing. TOKYO ELECTRON P-12 XL has a 12-axis tilt/rotation stage as well, which enables users to manipulate samples in any desired direction and orientation. This is achieved using voice-coil motor technology, providing high positional accuracy and resolution. The stage has a ±20° tilt range, and ±360° rotation capability. P-12XL has a 5-stage tip-tilt stage with an integrated auto-focusing unit, allowing for faster and more accurate measurements. This is done using RGB LED light sources and a high-resolution line sensor to provide a clearer picture. TEL P-12XL also utilizes state-of-the-art metrology capabilities, which allow for automatic wafer monitoring and mapping. Overall, TEL / TOKYO ELECTRON P 12 XL is a powerful and efficient prober with a wide range of features. Its compact form factor and intuitive graphical user interface allow for simple operation and ensure accurate test results. The integrated high-resolution guide machine and advanced die mounting tool provide accurate and repeatable sample positioning even over extended operation periods. Its advanced motion control capabilities ensure a greater range of motion with enhanced positional accuracy and resolution. Finally, its integrated auto-focusing asset and metrology capabilities facilitate improved wafer monitoring and mapping.
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