Used TEL / TOKYO ELECTRON P-12XLm #9265132 for sale

TEL / TOKYO ELECTRON P-12XLm is a semiconductor physical measurement prober, designed for precision probing, mapping, mapping-based probing and chip electrical analysis. It is a reliable and highly accurate tool, designed for probing, testing, and evaluating semiconductor materials. TEL P12XLM features a dual beam probe stage with a maximum chip size of 300 mm x 300 mm. The equipment is capable of reaching resolutions up to 30 microns for die and device mapping, and 10 microns for electrical measurements. The prober is equipped with two probe card readers with 3 axes alignment accuracy of +/-0.5 microns for X/Y & 0.1 microns for Z. It has an automated probe height control system ensuring consistent squeeze force management, which is adjustable for different applications. The prober also has a scan imaging unit, which provides users with an overview of the die configuration, and an automatic alignment unit, which allows it to detect the probe position relative to the imaged die, and perform die-to-die stitching when measuring multiple dies on a chip. TOKYO ELECTRON P 12 XLM is versatile and can accommodate a variety of probes, from contact and Kelvin clip type probes to 90 degree angled probes. It also supports various probe technologies including, RF, thermal imaging, capacitance/conductance, optical, and camera probes. The machine is capable of multi-channel electrical measurements on a single die, as well as high throughput measurements with beep/no-beep sampling methods. The prober is equipped with a robotic arm, allowing for automated wafer transportation and position adjustment. The robotic arm can also automatically insert the probe card when the wafer is secured in place. In summary, TEL / TOKYO ELECTRON P-12 XLM is a top-of-the-line semiconductor physical measurement prober that offers a wide range of capabilities. It has a dual beam probe stage and an accurate alignment tool, allowing for precise probing and testing. It's equipped with a scan imaging unit and a robot arm for wafer transport, and supports multi-channel electrical measurements. The prober is capable of reaching resolutions of up to 30 microns and is a reliable and highly accurate tool for semiconductor probing.