Used TEL / TOKYO ELECTRON P-12XLn+ #9090918 for sale

ID: 9090918
Vintage: 2004
Prober CPU Type: VIP3A Single cassette / wide loader type Nickel hot and cold chuck top, 12" Temperature controller WAPP SACC Input power: AC 200 V Temperature accuracy: ± 0.5°C (+Temperature) ± 1.0°C (-Temperature) Temperature resolution: 0.1°C Technology: Heater / cooler air type Chuck: Temperature up / down: -40ºC ⇔ +150ºC Chiller: Temp setting (0ºC - 20ºC) Stand by: Case by chuck temp +35ºC upper Dew point meter: Reading: -80ºC to +20ºC Purge air: (2) Solenoids: On / Off Wafer testing solution: -40ºC - +150ºC Options: Chiller: CT-50A Air cooling system (-40º ~ 150º) Air input: 25 SCFM at 80 ~ 125 PSI Operating range: -40°C ~ 200°C Temperature stability: ± 0.1°C AC 220 V / 60 Hz / 20 A Interface: RS-232C, IEEE-488 2004 vintage.
TEL / TOKYO ELECTRON P-12XLn+ Prober is a full-featured prober designed for performing advanced semiconductor wafer test and inspection. It is a multi-use tool that can be used for a wide variety of semiconductor wafer testing and inspection, from wafer imaging to 3D imaging of silicon dies. It features a high-performance chromatic and autofocus vision system with large field of view, which provides precise imaging resolutions, fast inspection scanning, and accurate automatic focus operations. The prober also features a multi-point, fast force laser (FFL) system, which enables fast and accurate 3D probing of wafer structure and components. TEL P12XLN+ also supports an extensive library of wafer test and analysis software suites, as well as an array of thermal measurement tools. TOKYO ELECTRON P 12 XLN+ is ideal for probing wafers with embedded transistors, inductors, metallic contacts, and other structures. The prober can detect and measure defects such as cracks, shorts, particle contamination, and under-layer defects. It is also capable of accurately measuring small gap sizes, such as inter-layer gap sizes, through-silicon-via (TSV) gap sizes, and passivation layer gap sizes. P 12 XLN+ also comes with a wide range of metrology and analysis tools, enabling users to characterize features and parameters in their wafers and components. The prober is designed with a robust and reliable platform, providing a stable, repeatable, and accurate probing environment for a wide range of wafers, from small, die-sized chips, to large wafers up to 12 inches. The low noise level of the prober also ensures spectroscopic imaging can be done with minimal interference. With its comprehensive toolset and large field of view, TEL / TOKYO ELECTRON P 12 XLN+ prober is the ideal tool for advanced high-yield wafer probing tasks.
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