Used TEL / TOKYO ELECTRON P-8 #293807112 for sale

TEL / TOKYO ELECTRON P-8 is a high-precision, automated prober designed for superior die fabrication and semiconductor inspection. This machine is used for the examination and probing of semiconductor dies for electrical and physical measurements. It is engineered to accommodate a variety of wafer and die packages, from small to large, in order to support the testing of complex 3D and flip-chip designs. The core of the prober is its laser scanning mechanism which provides maximum accuracy and versatility in wafer and die navigation. The laser scan head is capable of scanning down to 4 microns, making it ideal for precision measurements and probing of structures too small to be viewed with a conventional optical microscope. To ensure accuracy, the prober is also equipped with an autofocus routine which constantly adjusts to the height of the wafer or device. This also helps to prevent scattering due to misalignment of the scan head, improving data accuracy. The prober is further enhanced with an array of automated mechanisms for increased speed, accuracy and precision. It features a high-speed probe arm for contact probing with repeatability, as well as an air-jet for contactless probing. Its automated XYZ movement equipment is capable of positioning and adjusting the prober head at extremely precise angles. The system can also be configured with an optional Work Head Scanning Move Unit for testing wafers at different tilt angles. TEL P8 prober has a range of diagnostic and measurement tools and functions. Users can select between Total Image Capture and Zoom Image Capture for pattern analysis and die comparison. TOKYO ELECTRON P 8 also has an enhanced high-speed rotary measurement machine for die area and substrate measurements, as well as an autofocus tool for enhanced data accuracy. To ensure reliable operation and adjustment of the prober, the automated diagnostics and settings are saved to an onboard memory chip. TEL P 8 is an advanced prober asset ideal for wafer and die probing, testing and inspection. It combines precision laser scanning with a range of automated probing and imaging devices for reliable measurements and positioning. Its calibration and diagnostic functions ensure excellent data accuracy and repeatability for maximum process efficiency.