Used TEL / TOKYO ELECTRON P-8i #9356075 for sale

TEL / TOKYO ELECTRON P-8i is a prober developed by TEL, a Japanese semiconductor equipment manufacturer. This prober is used for the testing and characterization of semiconductor devices at the wafer level. It is suitable for use both in academia and the semiconductor industry. TEL P8I has a top load brushless drive mechanism, which provides high speed and accuracy, while also reducing maintenance needs. The top load feature also makes it easy to load and unload multiple devices on and off of the prober at the same time. Furthermore, the opto-electric isolation circuit ensures no cross-talk or leakage of electrical signals in the testing process. TOKYO ELECTRON P 8 I is a highly reliable and accurate product, providing reliable results to producers and users of semiconductor technologies. The prober has an integrated alignment camera, which helps with positioning and fine alignment of wafers. This is an important part of the testing process, as wafers need to be positioned accurately to ensure accurate tests. Furthermore, P-8i has low vibration performance, resulting in low noise. This makes it suitable for use in a variety of different environments, including laboratories and production lines. TOKYO ELECTRON P-8i also has an in-plane resolution of 1.5 μm, meaning that even small structures on the wafer can be identified accurately. This is an important feature for testing small devices like memory chips, as these need to be tested with extreme accuracy to ensure their performance and durability. In addition, P 8 I is capable of evaluating a wide range of different materials, including silicon, gallium arsenide, and III-V compounds, making it suitable for a wide range of applications. Overall, TEL / TOKYO ELECTRON P8I is a reliable and accurate prober, designed to make the testing of semiconductor devices easier and more accurate. It is suitable for both academic and industrial use, as it is reliable and has low vibration and noise levels. Furthermore, due to its high resolution, it is able to identify even small structures on the wafer, allowing for accurate testing of small components like memory chips. Finally, it is also capable of evaluating a wide range of different materials, making it suitable for a range of applications.